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Recently, the well-known semiconductor market analysis organization SEMI released a global 8-inch wafer fab outlook report. The report stated that the global 8-inch wafer equipment expenditure had long hovered between 2 billion and 3 billion US dollars from 2012 to 2019, and then exceeded 30 billion in 2020. 100 million U.S. dollars mark, this year equipment expenditure is expected to reach nearly 4 billion U.S. dollars.

The increase in 8-inch spending reflects part of the global semiconductor industry's efforts to overcome the current chip shortage.

SEMI CEO Ajit Manocha said: "The 8-inch wafer fab outlook report shows that by 2024, 22 new 8-inch wafer fabs are expected to be built around the world to meet the needs of 5G, integrated circuits that rely on analog chips, power management, and display drivers. The growing demand for cars and IoT devices."

This report covers the 8-inch wafer capacity from 2013 to 2024. This year, logic chip foundries will account for more than 50% of global fab capacity, analog chips account for 17%, and discrete devices account for 10%.

From a regional perspective, China will lead the world in 8-inch production capacity with 18% share this year, followed by Japan and Taiwan, each with 16%.