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According to the Korean Herald, I-Cube4 is a heterogeneous integration technology that can integrate one or more logic chips and multiple high-bandwidth memory (HBM) chips on a silicon-based interposer.

In 2018, Samsung Electronics officially released the I-Cube technology, integrating a logic chip with two HBMs, and applying it to Baidu's Kunlun AI computing processor in 2019.

Samsung said that I-Cube4 contains four HBMs and a logic chip, which can be used in various fields such as high-performance computing (HPC), AI, 5G, cloud, and data centers.

Generally speaking, as the complexity of the chip increases, the silicon-based interposer will become thicker and thicker, but Samsung’s I-Cube4 technology controls the thickness of the silicon-based interposer to only about 100 microns, but this also brings Higher chance of bending or warping. It is reported that Samsung has successfully commercialized the I-Cube4 packaging technology by changing the material and thickness to control the warpage and thermal expansion of the silicon bottom interposer.

In addition, the Samsung I-Cube4 package also has a unique mold-free structure that can pass pre-screening tests to screen out defective products during the manufacturing process, thereby effectively improving heat dissipation efficiency and product yield, saving costs and time to market .

In addition, Samsung is also currently developing a more advanced and more complex I-Cube6, which can simultaneously encapsulate six HBMs, and a more complex 2.5D/3D hybrid packaging technology.