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On June 15, Samsung Electronics announced that it has begun mass production of multi-chip package (uMCP) products that integrate DRAM and NAND flash memory.


This product combines low-power mobile memory (LPDDR5) and UFS3.1 interface NAND flash memory on flagship smartphones into one, providing high-configuration solutions for smartphone manufacturers.

According to Samsung Electronics, compared with the previous LPDDR4X-based UFS 2.2 solution, the LPDDR5 performance of the new product has increased by nearly 50%, from 17GB/s per second to 25GB/s, and the performance of NAND flash memory has doubled from 1.5 GB/s is increased to 3GB/s.

The new uMCP also helps maximize the space efficiency of smartphones by integrating DRAM and NAND storage into a single compact package measuring only 11.5 mm x 13 mm, thereby providing more space for other functions.

In addition, Samsung uMCP can be easily customized to meet the diverse needs of 5G smartphones in the entire mid-to-high-end market. DRAM capacities range from 6GB to 12GB, and storage options range from 128GB to 512GB.

Samsung has successfully completed LPDDR5 uMCP compatibility testing with many global smartphone manufacturers, and it is expected that the UMCP equipment it is equipped with will begin to enter the mainstream market this month.